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CY7C1414BV18-200BZC IC SRAM 36MBIT PARALLEL 165FBGA Cypress Semiconductor Corp

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CY7C1414BV18-200BZC IC SRAM 36MBIT PARALLEL 165FBGA Cypress Semiconductor Corp

Brand Name : Cypress Semiconductor Corp

Model Number : CY7C1414BV18-200BZC

MOQ : 1

Price : Based on current price

Payment Terms : T/T

Supply Ability : In stock

Delivery Time : 3-5 work days

Packaging Details : anti-static bag & cardboard box

Memory Type : Volatile

Memory Format : SRAM

Technology : SRAM - Synchronous, QDR II

Memory Size : 36Mbit

Memory Organization : 1M x 36

Memory Interface : Parallel

Clock Frequency : 200 MHz

Write Cycle Time - Word, Page : -

Access Time : -

Voltage - Supply : 1.7V ~ 1.9V

Operating Temperature : 0°C ~ 70°C (TA)

Mounting Type : Surface Mount

Package / Case : 165-LBGA

Supplier Device Package : 165-FBGA (15x17)

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Product Details

Functional Description

The CY7C1425KV18, CY7C1412KV18, and CY7C1414KV18 are 1.8 V synchronous pipelined SRAMs, equipped with QDR II architecture. QDR II architecture consists of two separate ports: the read port and the write port to access the memory array. The read port has dedicated data outputs to support read operations and the write port has dedicated data inputs to support write operations.

Features

■ Separate independent read and write data ports
❐ Supports concurrent transactions
■ 333 MHz clock for high bandwidth
■ Two-word burst on all accesses
■ Double data rate (DDR) Interfaces on both read and write ports (data transferred at 666 MHz) at 333 MHz
■ Two input clocks (K and K) for precise DDR timing
❐ SRAM uses rising edges only
■ Two input clocks for output data (C and C) to minimize clock skew and flight time mismatches
■ Echo clocks (CQ and CQ) simplify data capture in high speed systems
■ Single multiplexed address input bus latches address inputs for both read and write ports
■ Separate port selects for depth expansion
■ Synchronous internally self-timed writes
■ QDR® II operates with 1.5 cycle read latency when DOFF is asserted HIGH
■ Operates similar to QDR I device with 1 cycle read latency when DOFF is asserted LOW
■ Available in × 9, × 18, and × 36 configurations
■ Full data coherency, providing most current data
■ Core VDD = 1.8 V (±0.1 V); I/O VDDQ = 1.4 V to VDD
❐ Supports both 1.5 V and 1.8 V I/O supply
■ Available in 165-ball FBGA package (13 × 15 × 1.4 mm)
■ Offered in both Pb-free and non Pb-free Packages
■ Variable drive HSTL output buffers
■ JTAG 1149.1 compatible test access port
■ Phase locked loop (PLL) for accurate data placement

Specifications

Attribute Attribute Value
Manufacturer Cypress Semiconductor
Product Category Memory ICs
Series -
Packaging Tray
Package-Case 165-LBGA
Operating-Temperature 0°C ~ 70°C (TA)
Interface Parallel
Voltage-Supply 1.7 V ~ 1.9 V
Supplier-Device-Package 165-FBGA (15x17)
Memory Capacity 36M (1M x 36)
Memory-Type SRAM - Synchronous, QDR II
Speed 200MHz
Format-Memory RAM

Descriptions

SRAM - Synchronous, QDR II Memory IC 36Mb (1M x 36) Parallel 200MHz 165-FBGA (15x17)

China CY7C1414BV18-200BZC IC SRAM 36MBIT PARALLEL 165FBGA Cypress Semiconductor Corp factory

CY7C1414BV18-200BZC IC SRAM 36MBIT PARALLEL 165FBGA Cypress Semiconductor Corp Images

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